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Description

Preparation of electronic component pins and leads before soldering

The information in the manufacturer's material only confirms that the Heating element HGP/HAP 1 is intended for HGP and HAP1

Material specified as polyester

which supports sensitive and rapid turning

Serie: LK-4N-F10

Monitor arm til fladskærm til WB/WS+WTR borde incl.AP100 Unit(s):Pcs Preparation of electronic component pins. The quick release mechanism is equipped with the standard used flat screen mount 75x75 and 100x100 for the mounting of all normal flat screens.

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