reduce heat to 200°F and let sit for 30 minutes

It is ideal for grid structures

Stable dielectric constant and dissipation factor over a wide range of temperatures and frequencies

Surface conductivity as a function of extruder temperature:

ideal for printing complex flexible parts

Lehvoss Luvocom 3F PAHT 9825 BVOH reduce heat to 200°F andHigh performance polyamide filament from the LEHVOSS Group. LUVOOCM 3F PAHT 9825 NT filament is an unfilled, high temperature resistant polyamide (PA) material. It has the strength of PA6 without compromising printability. Water absorption is half the rate and the absorption rate is four times slower than standard PA6 filaments. 3D printed components made with this material exhibit high strength and toughness. It is compatible with HIPS and PVOH